- Low temperature wafer-level bonding for hermetic packaging of 3D microsystems - art. no. 075006
[作者:Tan, CS; Fan, J; Lim, DF; Chong, GY; Li, KH,期刊:Journal of Micromechanics and Microengineering, 页码:75006-75006 , 文章类型: 期刊论文,,卷期:2011年21-7]
- Metallic copper-copper (Cu-Cu) thermo-compression bonding, oxide-oxide (SiO2-SiO2) fusion bonding and silicon-silicon (Si-Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem p...
- MEMS silicon-based micro-evaporator - art. no. 075007
[作者:Mihailovic, M; Rops, CM; Hao, J; Mele, L; Creemer, JF; Sarro, PM,期刊:Journal of Micromechanics and Microengineering, 页码:75007-75007 , 文章类型: 期刊论文,,卷期:2011年21-7]
- An increase in the energy density in device miniaturization and chemical process intensification generates intense local heating. Properly designed devices for heat absorption, such as evaporators, are essential for deal...
- MEMS-plunger platform for tunable terahertz wire laser at similar to 5 K - art. no. 075004
[作者:Qin, Q; Hu, Q,期刊:Journal of Micromechanics and Microengineering, 页码:75004-75004 , 文章类型: 期刊论文,,卷期:2011年21-7]
- The tuning of a terahertz quantum cascade wire laser, operated at similar to 5 K, is demonstrated using a micro-machined metal or silicon object, called a 'plunger', attached to a MEMS-based two-stage flexure and actuate...
- Novel piezoelectric actuation mechanism for a gimbal-less mirror in 2D raster scanning applications - art. no. 075001
[作者:Koh, KH; Kobayashi, T; Xie, J; Yu, AB; Lee, CK,期刊:Journal of Micromechanics and Microengineering, 页码:75001-75001 , 文章类型: 期刊论文,,卷期:2011年21-7]
- In this paper, we present the design, fabrication and measurement results of a 2D scanning mirror actuated by 1 x 10 piezoelectric Pb(Zr, Ti)O-3 (PZT) cantilever actuators integrated on a thin silicon beam. A combination...
- A microdevice with large deflection for variable-ratio RF MEMS power divider applications - art. no. 074013
[作者:Li, Y; Kuhne, S; Psychogiou, D; Hesselbarth, J; Hierold, C,期刊:Journal of Micromechanics and Microengineering, 页码:74013-74013 , 文章类型: 期刊论文,,卷期:2011年21-7]
- In this paper, we present the design and fabrication of a large deflection MEMS actuator directly integrated as a variable-ratio radio frequency (RF) power divider in a waveguide. The device is based on a tilting micropl...
- Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process - art. no. 074012
[作者:Aarts, AAA; Srivannavit, O; Wise, KD; Yoon, E; Puers, R; Van Hoof, C; Neves, HP,期刊:Journal of Micromechanics and Microengineering, 页码:74012-74012 , 文章类型: 期刊论文,,卷期:2011年21-7]
- A compressible multifunctional interconnect for out-of-plane MEMS structures has been fabricated using a thin film transfer bonding technique and bio-tolerable materials. The bulk material of the stretchable film consist...
- Inclined-wall regular micro-pillar-arrayed surfaces covered entirely with an alumina nanowire forest and their improved superhydrophobicity - art. no. 075024
[作者:Kim, DH; Kim, Y; Kang, JW; Hong, S; Lee, D; Cho, CR; Kim, SH; Lee, DW; Kim, JM,期刊:Journal of Micromechanics and Microengineering, 页码:75024-75024 , 文章类型: 期刊论文,,卷期:2011年21-7]
- This paper reports a multiple-scale hierarchically structured superhydrophobic surface that is composed of inclined-wall regular micro-pillar arrays covered entirely with an alumina nanowire forest (ANF) to improve the s...
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