Low temperature wafer-level bonding for hermetic packaging of 3D microsystems - art. no. 075006

[摘要]：Metallic copper-copper (Cu-Cu) thermo-compression bonding, oxide-oxide (SiO2-SiO2) fusion bonding and silicon-silicon (Si-Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem packaging. Cavities are etched to a

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