- Plasma-assisted quartz-to-quartz direct bonding for the fabrication of a multilayered quartz template for nanoimprint lithography
[作者:Lee, J; Ali, A; Kim, KD; Kim, JH; Choi, DG; Choi, JH; Jeong, JH,期刊:Journal of Micromechanics and Microengineering, 页码:45005-45005 , 文章类型: Article,,卷期:2010年20-4]
- In this paper, a low-temperature plasma-assisted process is developed to realize a uniform, ultraviolet (UV) transparent and chemically inert quartz-to-quartz direct bonding. Two sets of pretests are performed in order t...
- Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
[作者:Okoro, C; Vanstreels, K; Labie, R; Luhn, O; Vandevelde, B; Verlinden, B; Vandepitte, D,期刊:Journal of Micromechanics and Microengineering, 页码:45032-45032 , 文章类型: Article,,卷期:2010年20-4]
- In this paper, the effect of annealing condition on the microstructural and mechanical behavior of copper through-silicon via (Cu-TSV) is studied. The hardness of Cu-TSV scaled with the Hall-Petch relation, with the aver...
- Active control of flow and heat transfer in silicon microchannels
[作者:Liu, GH; Xu, JL; Yang, YP; Zhang, AW,期刊:Journal of Micromechanics and Microengineering, 页码:45006-45006 , 文章类型: Article,,卷期:2010年20-4]
- Boiling heat transfer in silicon microchannels needs high walls and liquid superheats for bubble nucleation, leading to a strong thermal non-equilibrium between vapor and liquid phases, which not only damages the heat tr...
- A technique to design complex 3D lab on a chip involving multilayered fluidics, embedded thick electrodes and hard packaging-application to dielectrophoresis and electroporation of cells
[作者:Mottet, G; Villemejane, J; Mir, LM; Le Pioufle, B,期刊:Journal of Micromechanics and Microengineering, 页码:47001-47001 , 文章类型: Article,,卷期:2010年20-4]
- Nowadays, lab on chips (LOCs) require the development of new technologies in order to integrate complex fluidics, sensors, actuators, etc. Such integration requires overcoming both technological bottlenecks and an increa...
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