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A technique to design complex 3D lab on a chip involving multilayered fluidics, embedded thick electrodes and hard packaging-application to dielectrophoresis and electroporation of cells

  作者 Mottet, G; Villemejane, J; Mir, LM; Le Pioufle, B  
  选自 期刊  Journal of Micromechanics and Microengineering;  卷期  2010年20-4;  页码  47001-47001  
  关联知识点  
 

[摘要]Nowadays, lab on chips (LOCs) require the development of new technologies in order to integrate complex fluidics, sensors, actuators, etc. Such integration requires overcoming both technological bottlenecks and an increase in production cost. We propose a

 
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