Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing - art. no. 065026

[摘要]：Recently, as integration density of electrical devices has increased, multi-layered, fine-patterned printed circuit board (PCB) technology has been advancing. As a high-volume, low-cost manufacturing method, PCB fabrication by imprinting has gained much a

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