[摘要]：A scalable electrochemical process for addressing the thermomechanical compliance and contact resistance at metal/thermoelectric (M/TE) interfaces by integrating TE films with carbon nanotube (CNT) arrays is presented. Thermomechanical compliance and thermal contact characteristics of TE/CNT/M and TE/M contacts are compared. A process-flow for patterned electrodeposition of TE films on CNT arrays coated surfaces is also demonstrated.
