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Effects of mechanical stress on thermal microactuator performance

  作者 Phinney, LM; Spletzer, MA; Baker, MS; Serrano, JR  
  选自 期刊  Journal of Micromechanics and Microengineering;  卷期  2010年20-9;  页码  95011-95011  
  关联知识点  
 

[摘要]Mechanical stresses on microsystems die induced by packaging processes and varying environmental conditions can affect the performance and reliability of microsystems devices. Thermal microactuators and stress gauges were fabricated using the Sandia five-

 
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