个性化文献订阅>期刊> Sensors And Actuators A-Physical
 

A wafer-scale etching technique for high aspect ratio implantable MEMS structures

  作者 Bhandari, R; Negi, S; Rieth, L; Solzbacher, F  
  选自 期刊  Sensors And Actuators A-Physical;  卷期  2010年162-1;  页码  130-136  
  关联知识点  
 

[摘要]Microsystem technology is well suited to batch fabricate microelectrode arrays, such as the Utah electrode array (UEA), intended for recording and stimulating neural tissue. Fabrication of the UEA is primarily based on the use of dicing and wet etching to

 
      被申请数(0)  
 

[全文传递流程]

一般上传文献全文的时限在1个工作日内