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The effect of pitch on deformation behavior and the stretching-induced failure of a polymer-encapsulated stretchable circuit

  作者 Hsu, YY; Gonzalez, M; Bossuyt, F; Axisa, F; Vanfleteren, J; DeWolf, I  
  选自 期刊  Journal of Micromechanics and Microengineering;  卷期  2010年20-7;  页码  75036-75036  
  关联知识点  
 

[摘要]The deformation behavior and failure mechanisms of parallel-aligned, horseshoe-patterned, stretchable conductors encapsulated in a polymer substrate were investigated by numerical and experimental analyses. A design guideline for the optimal pitch between

 
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