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A 3D micromechanical compass

  作者 Kyynarainen, J; Saarilahti, J; Kattelus, H; Karkkainen, A; Meinander, T; Oja, A; Pekko, P; Seppa, H; Suhonen, M; Kuisma, H; Ruotsalainen, S; Tilli, M  
  选自 期刊  Sensors And Actuators A-Physical;  卷期  2008年142-2;  页码  561-568  
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[摘要]We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10nT/root Hz at-a coil, current of, 100 mu A. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/root Hz. The standard deviation of the signal was less than 1% over a period of a few days. (C) 2007 Elsevier B.V. All rights reserved.

 
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