个性化文献订阅>期刊> Applied Physics Letters
 

Fracture of nanoscale copper films on elastomer substrates

  作者 Begley, MR; Scott, ON; Utz, M; Bart-Smith, H  
  选自 期刊  Applied Physics Letters;  卷期  2009年95-23;  页码  231914-231914  
  关联知识点  
 

[摘要]This letter describes the evolution of crack spacing in copper films (bonded to elastomer substrates) as a function of applied strain. Tension tests were conducted on cast poly(dimethylsiloxane) substrates coated with sputtered copper films with 200-600 n

 
      被申请数(0)  
 

[全文传递流程]

一般上传文献全文的时限在1个工作日内