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Reverse gate bias-induced degradation of AlGaN/GaN high electron mobility transistors

  作者 Chang, CY; Anderson, T; Hite, J; Lu, L; Lo, CF; Chu, BH; Cheney, DJ; Douglas, EA; Gila, BP; Ren, F; Via, GD; Whiting, P; Holzworth, R; Jones, KS; Jang, S; Pearton, SJ  
  选自 期刊  Journal Of Vacuum Science & Technology B;  卷期  2010年28-5;  页码  1044-1047  
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[摘要]A threshold reverse bias of similar to 21 V was observed leading to a sharp increase in the gate current of AlGaN/GaN high electron mobility transistors biased at low source-drain voltage (5 V). The gate current increases by one to two orders of magnitude at this bias, corresponding to an electric field strength around 1.8 MV cm(-1). The gate current increased by roughly five orders of magnitude after step-stressing the gate bias from 10 to 42 V in 1 V increments for 1 min at each bias. The drain current was also decreased by similar to 20% after this step-stress cycle. The photoluminescence and electroluminescence intensity from the semiconductor is decreased along the periphery of the gate region after stressing and transmission electron microscopy shows a thin native oxide layer under the gate and this disappears as the gate metal reacts with the underlying AlGaN. (C) 2010 American Vacuum Society. [DOI: 10.1116/1.3491038]

 
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