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Novel technique for formation of metal lines by functional liquid containing metal nanoparticles and reduction of their resistivity by hydrogen treatment

  作者 Kieu, TT; Ohdaira, K; Shimoda, T; Matsumura, H  
  选自 期刊  Journal Of Vacuum Science & Technology B;  卷期  2010年28-4;  页码  775-782  
  关联知识点  
 

[摘要]A novel technique for formation of metal lines for electronic devices, and for reduction of resistivity in such metal lines, is proposed. In the technique, the metal lines are formed in trenches by using functional liquids containing metal nanoparticles.

 
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