Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology

[摘要]：Resistivity augmentation in nanoscale metal interconnects is a performance limiting factor in integrated circuits. Here we present calculations of electron scattering and transmission at the interface between Cu interconnects and their barrier layers, in

[全文传递流程]：

一般上传文献全文的时限在1个工作日内