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[摘要]：A process to slice and separate GaN device layers for vertical light emitting diodes (LEDs) is presented through a developed electrochemical anodization process to create nanoporous (NP) GaN of designed porosity profiles. The NP GaN serves dual purposes of supporting subsequent overgrowth of LED structures while undergoing, during growth, shape transformation into a largely voided morphology. It is shown that this voided region decreases the lateral fracture resistance and enables large-area separation of the LED structures after appropriate wafer bonding. The separated LED layers are shown to have comparable material quality before and after the liftoff process. Blue emitting GaN LEDs are transferred to silicon substrates with vertical configuration by this unique process. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4711218] |
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