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Detailed simulation study of embedded SiGe and Si:C source/drain stressors in nanoscaled silicon on insulator metal oxide semiconductor field effect transistors

  作者 Flachowsky, S; Illgen, R; Herrmann, T; Klix, W; Stenzel, R; Ostermay, I; Naumann, A; Wei, A; Hontschel, J; Horstmann, M  
  选自 期刊  Journal Of Vacuum Science & Technology B;  卷期  2010年28-1;  页码  C1G12-C1G17  
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[摘要]Strained silicon techniques have become an indispensable technology feature, enabling the momentum of semiconductor scaling. Embedded silicon-germanium (eSiGe) is already widely adopted in the industry and delivers outstanding p-metal oxide semiconductor

 
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