The relationship between structural evolution and electrical percolation of the initial stages of tungsten chemical vapor deposition on polycrystalline TiN - art. no. 031907

[摘要]：This paper presents experimental results and a geometric model of the evolution of sheet resistance and surface morphology during the transition from nucleation to percolation of tungsten chemical vapor deposition over ultrathin polycrystalline titanium nitride (TiN). We observed two mechanisms of reduction in sheet resistance. At deposition temperatures higher than 310 degrees C, percolation effect is formed at similar to 35% of surface coverage, theta, and characterized with a sharp drop in resistance. At temperature below 310 degrees C, a reduction in resistance occurs in two steps. The first step occurs when theta = 35% and the second step at theta = 85%. We suggest a geometric model in which the electrical percolation pass is modulated by the thickness threshold of the islands at the instant of collision. (C) 2012 American Institute of Physics. [doi:10.1063/1.3678194]

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