- Fabrication, characteristics and temperature stability of Pb(Mg1/3Nb2/3)O-3-Pb(Sb1/3Nb2/3)O-3-Pb(Ni1/3Nb2/3)O-3-Pb(Zr, Ti)O-3 piezoelectric actuators
[作者:Chao, XL; Yang, ZP; Dong, MY; Li, G,期刊:Sensors And Actuators A-Physical, 页码:71-76 , 文章类型: Article,,卷期:2009年151-1]
- (0.05-x)Pb(Mg1/3Nb2/3)O-3-xPb(Sb1/3Nb2/3)O-3-0.10Pb(Ni1/3Nb2/3)O-3-0.85Pb(Zr1/2Ti1/2)O-3 piezoelectric ceramics (abbreviated as PMN-PSN-PNN-PZT) were synthesized by traditional ceramics process. The effects of Pb(Sb1/3Nb...
- Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation
[作者:Tang, ZR; Peng, P; Shi, TL; Liao, GL; Nie, L; Li, SY,期刊:Sensors And Actuators A-Physical, 页码:81-86 , 文章类型: Article,,卷期:2009年151-1]
- Low temperature direct wafer bonding is a promising technology for microelectromechanical systems (MEMS), sensors as well as silicon-on-insulator (SOI) materials. The bond quality is closely related to the wafer-bow, sur...
|