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  • Are extreme ultraviolet resists ready for the 32 nm node?
    [作者:Petrillo, K; Wei, Y; Brainard, R; Denbeaux, G; Goldfarb, D; Koay, CS; Mackey, J; Montgomery, W; Pierson, W; Wallow, T; Wood, O,期刊:Journal Of Vacuum Science & Technology B, 页码:2490-2495 , 文章类型: Article,,卷期:2007年25-6]
  • The International Technology Roadmap for Semiconductors (ITRS) insertion point of extreme ultraviolet (EUV) lithography is the 32 nm half-pitch node, and significant worldwide effort is being focused toward this goal. Po...