- Compact electrode design for an in-plane accelerometer on SOI with refilled isolation trench - art. no. 095005
[作者:Xie, J; Agarwal, R; Liu, YH; Tsai, JM; Ranganathan, N; Singh, J,期刊:Journal of Micromechanics and Microengineering, 页码:95005-95005 , 文章类型: Article,,卷期:2011年21-9]
- A two-axis in-plane capacitive accelerometer containing a refilled isolation trench is fabricated in 50 mu m silicon-on-insulator (SOI). In the accelerometer, each stationary electrode is split into two sub-stationary el...
- Numerical analysis and demonstration of a 2-DOF large-size micromirror with sloped electrodes - art. no. 095006
[作者:Jin, JY; Park, JH; Yoo, BW; Jang, YH; Kim, YK,期刊:Journal of Micromechanics and Microengineering, 页码:95006-95006 , 文章类型: Article,,卷期:2011年21-9]
- We report on the numerical analysis and demonstration of a two-degree-of-freedom (2-DOF) micromirror with a large mirror plate and a reduced actuation voltage. The micromirror consists of two layers, namely, a top layer ...
- High-resolution permanent photoresist laminate TMMF for sealed microfluidic structures in biological applications - art. no. 095009
[作者:Wangler, N; Gutzweiler, L; Kalkandjiev, K; Muller, C; Mayenfels, F; Reinecke, H; Zengerle, R; Paust, N,期刊:Journal of Micromechanics and Microengineering, 页码:95009-95009 , 文章类型: Article,,卷期:2011年21-9]
- We demonstrate the use of photosensitive epoxy laminate TMMF S2045 for the fabrication and sealing of tapered microfluidic channels. The 45 mu m thick resist enables the fabrication of shallow sealed cavities featuring e...
- Microengineered structures for rapid automatic loading of optical fibre segments - art. no. 095010
[作者:Combariza, ME; Shah, CM; Sriram, S; Bhaskaran, M; Kostovski, G; Nasabi, M; Mitchell, A,期刊:Journal of Micromechanics and Microengineering, 页码:95010-95010 , 文章类型: Article,,卷期:2011年21-9]
- We present a technique to rapidly and automatically produce sections of optical fibre and load them into arrays such that they can be nano-imprinted in parallel. The technique makes use of automated fibre feeding, cuttin...
- Sacrificial bridges for MEMS fabrication - art. no. 095012
[作者:Chang, CM; Chen, YC; Fong, CF; Guu, YH; Chen, RS; Yeh, JA; Hou, MT,期刊:Journal of Micromechanics and Microengineering, 页码:95012-95012 , 文章类型: Article,,卷期:2011年21-9]
- This study discusses sacrificial bridges that are used to release MEMS devices. Before being released, sacrificial bridges connect all the component structures into an integral structure. Solder bump bonding is used to m...
- Characterization of C-PDMS electrodes for electrokinetic applications in microfluidic systems - art. no. 095013
[作者:Deman, AL; Brun, M; Quatresous, M; Chateaux, JF; Frenea-Robin, M; Haddour, N; Semet, V; Ferrigno, R,期刊:Journal of Micromechanics and Microengineering, 页码:95013-95013 , 文章类型: Article,,卷期:2011年21-9]
- This paper reports on the integration of thick carbon-polydimethylsiloxane (C-PDMS) electrodes in microfluidic systems for electrokinetic operations. The C-PDMS material, obtained by mixing carbon nanopowder and PDMS, pr...
- Fabrication of a vibration-driven electromagnetic energy harvester with integrated NdFeB/Ta multilayered micro-magnets - art. no. 095014
[作者:Jiang, YG; Masaoka, S; Fujita, T; Uehara, M; Toyonaga, T; Fujii, K; Higuchi, K; Maenaka, K,期刊:Journal of Micromechanics and Microengineering, 页码:95014-95014 , 文章类型: Article,,卷期:2011年21-9]
- This paper describes the fabrication of MEMS-based electromagnetic energy harvesters for scavenging energy from the ambient vibration. The novel energy harvester is fabricated by bonding a vibrator with embedded micro-ma...
- Elastic region of an ACF joint for thermosonic flip-chip bonding - art. no. 095015
[作者:Ha, CW; Jang, TY; Kim, KR; Yun, WS; Kim, KS,期刊:Journal of Micromechanics and Microengineering, 页码:95015-95015 , 文章类型: Article,,卷期:2011年21-9]
- In this paper, a thermosonic flip-chip bonding method using vibration in the lateral direction is proposed. To enhance the reliability and alignment of the specimen after the thermosonic process, an elastic region of ani...
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