- Polycondensation-type Ge nanofractal assembly
[作者：Chen, ZW; Li, QB; Pan, DY; Zhang, HJ; Jiao, Z; Wu, MH; Shek, CH; Wu, L; Lai, JKL,期刊：Materials Today, 页码：106-113 , 文章类型： Article，,卷期：2011年14-3]
- The group IV semiconductors such as silicon (Si) and germanium (Ge) are unique materials with a wide range of technological applications. A versatile integrated device for the semiconductor industry is highly desirable f...
- Reverse engineering of multi-layer films
[作者：Widjaja, E; Garland, M,期刊：Materials Today, 页码：114-117 , 文章类型： Article，,卷期：2011年14-3]
- This contribution introduces the combined application of Raman microscopy and band-target entropy minimization (BTEM) in order to successfully reverse-engineer a multi-layer packaging material. Three layers are identifie...
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