- Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics - art. no. 035009
[作者:Mei, FH; Phillips, WA; Lu, B; Meng, WJ; Guo, S,期刊:Journal of Micromechanics and Microengineering, 页码:35009-35009 , 文章类型: Article,,卷期:2009年19-3]
- Metal-based microchannel heat exchangers (MHEs) offer potential solutions to high heat flux removal applications, such as cooling of high-performance microelectronic and energy-efficient lighting modules. Efficient fabri...
- Anodic oxidation of polycrystalline 3C-silicon carbide thin films during MEMS operation - art. no. 035024
[作者:Liu, F; Roper, CS; Laboriante, I; Bush, B; Chu, JR; Carraro, C; Maboudian, R,期刊:Journal of Micromechanics and Microengineering, 页码:35024-35024 , 文章类型: Article,,卷期:2009年19-3]
- In this paper, we provide the first report of corrosion occurring at the anode of polycrystalline 3C-silicon carbide MEMS electrodes under high relative humidity and applied voltage. This unusual phenomenon is determined...
- A low-loss, single-pole, four-throw RF MEMS switch driven by a double stop comb drive - art. no. 035011
[作者:Kang, S; Kim, HC; Chun, K,期刊:Journal of Micromechanics and Microengineering, 页码:35011-35011 , 文章类型: Article,,卷期:2009年19-3]
- Our goal was to develop a single-pole four-throw (SP4T) radio frequency microelectromechanical system (RF MEMS) switch for band selection in a multi-band, multi-mode, front-end module of a wireless transceiver system. Th...
- Fabrication of morphological defect-free vertical electrodes using a (110) silicon-on-patterned-insulator process for micromachined capacitive inclinometers - art. no. 035025
[作者:Yun, SS; Jeong, DH; Wang, SM; Je, CH; Lee, ML; Hwang, G; Choi, CA; Lee, JH,期刊:Journal of Micromechanics and Microengineering, 页码:35025-35025 , 文章类型: Article,,卷期:2009年19-3]
- This paper presents a novel fabrication method of scalloping-free and footing-free vertical electrodes for micromachined capacitive inclinometers with a high sensing resolution. The proposed fabrication method is based o...
- Black silicon method X: a review on high speed and selective plasma etching of silicon with profile control: an in-depth comparison between Bosch and cryostat DRIE processes as a roadmap to next generation equipment - art. no. 033001
[作者:Jansen, HV; de Boer, MJ; Unnikrishnan, S; Louwerse, MC; Elwenspoek, MC,期刊:Journal of Micromechanics and Microengineering, 页码:33001-33001 , 文章类型: Review,,卷期:2009年19-3]
- An intensive study has been performed to understand and tune deep reactive ion etch (DRIE) processes for optimum results with respect to the silicon etch rate, etch profile and mask etch selectivity (in order of priority...
- Electromagnetic energy harvesting from vibrations of multiple frequencies - art. no. 035001
[作者:Yang, B; Lee, C; Xiang, WF; Xie, J; He, JH; Kotlanka, RK; Low, SP; Feng, HH,期刊:Journal of Micromechanics and Microengineering, 页码:35001-35001 , 文章类型: Article,,卷期:2009年19-3]
- A novel multi-frequency energy harvester has been designed and fabricated, which consists of three permanent magnets, three sets of two-layer copper coils and a supported beam of acrylic, while these coils are made of th...
- An active micro joining mechanism for 3D assembly - art. no. 035012
[作者:Mayyas, M; Zhang, P; Lee, WH; Popa, D; Chiao, JC,期刊:Journal of Micromechanics and Microengineering, 页码:35012-35012 , 文章类型: Article,,卷期:2009年19-3]
- An active joining mechanism for the construction of microstructures, comprising detethered microparts and locking actuators fabricated on a wafer, has been implemented. An active locking mechanism is a system on chip (SO...
- A parylene-filled-trench technique for thermal isolation in silicon-based microdevices - art. no. 035013
[作者:Lei, YH; Wang, W; Yu, HQ; Luo, YC; Li, T; Jin, YF; Zhang, HX; Li, ZH,期刊:Journal of Micromechanics and Microengineering, 页码:35013-35013 , 文章类型: Article,,卷期:2009年19-3]
- Microdevices prepared in a silicon substrate have been widely used in versatile fields due to the matured silicon-based microfabrication technique and the excellent physical properties of silicon material. However, the h...
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