- Fabrication and testing of a CoNiCu/Cu CPP-GMR nanowire-based microfluidic biosensor
[作者:Bellamkonda, R; John, T; Mathew, B; DeCoster, M; Hegab, H; Davis, D,期刊:Journal of Micromechanics and Microengineering, 页码:25012-25012 , 文章类型: Article,,卷期:2010年20-2]
- Giant magneto resistance (GMR)-based microfluidic biosensors are used in applications involving the detection, analysis, enumeration and characterization of magnetic nano-particles attached to biological mediums such as ...
- A pseudo 3D glass microprobe array: glass microprobe with embedded silicon for alignment and electrical interconnection during assembly
[作者:Lee, YT; Lin, CW; Lin, CM; Yeh, SR; Chang, YC; Fang, W,期刊:Journal of Micromechanics and Microengineering, 页码:25014-25014 , 文章类型: Article,,卷期:2010年20-2]
- This study presents a process for the assembling of a pseudo 3D glass microprobe array. A glass microprobe with embedded silicon (ES) is batch fabricated by a glass reflow process. The silicon fixture and carrier for the...
- A 'mesh' seed layer for improved through-silicon-via fabrication
[作者:Lai, JH; Yang, HS; Chen, H; King, CR; Zaveri, J; Ravindran, R; Bakir, MS,期刊:Journal of Micromechanics and Microengineering, 页码:25016-25016 , 文章类型: Article,,卷期:2010年20-2]
- This paper describes an improved method of forming and removing seed layers for through-silicon-vias (TSVs) in applications such as MEMS, sensors and packaging (silicon carrier, for example). A 'mesh seed layer' is propo...
- An investigation of microstructure and mechanical properties of UV-LIGA nickel thin films electroplated in different electrolytes
[作者:Tang, J; Wang, H; Guo, XQ; Liu, R; Dai, XH; Ding, GF; Yang, CS,期刊:Journal of Micromechanics and Microengineering, 页码:25033-25033 , 文章类型: Article,,卷期:2010年20-2]
- Different electrolytes are used to fabricate nickel structures in MEMS devices by the LIGA or UV-LIGA process to meet different requirements. In order to investigate the microstructure and mechanical properties of nickel...
- An optical absolute pressure sensor for high-temperature applications, fabricated directly on a fiber (vol 19, 115017, 2009)
[作者:Ceyssens, F; Driesen, M; Puers, R,期刊:Journal of Micromechanics and Microengineering, 页码:29801-29801 , 文章类型: Correction,,卷期:2010年20-2]
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