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  • Etching mechanisms of thin SiO2 exposed to Cl-2 plasma
    [作者:Petit-Etienne, C; Darnon, M; Vallier, L; Pargon, E; Cunge, G; Fouchier, M; Bodart, P; Haass, M; Brihoum, M; Joubert, O; Banna, S; Lill, T,期刊:Journal Of Vacuum Science & Technology B, 页码:51202-51202 , 文章类型: Article,,卷期:2011年29-5]
  • Plasma etching is the most standard patterning technology used in micro-and nano-technologies. Chlorine-based plasmas are often used for silicon etching. However, the behavior of thin silicon oxide exposed to such a plas...