- Air cooling of a microelectronic chip with diverging metal microchannels monolithically processed using a single mask - art. no. 115022
[作者:Joo, Y; Yeh, HCT; Dieu, K; Kim, CJ,期刊:Journal of Micromechanics and Microengineering, 页码:15022-15022 , 文章类型: Article,,卷期:2008年18-11]
- A single-mask process is used to fabricate metal microchannels of 5-10 mu m in width, 10-40 mu m in height and millimeters in length, monolithically (i.e., no bonding) on the chip front side. Taking advantage of the smal...
- Nano-porous electrode systems by colloidal lithography for sensitive electrochemical detection: fabrication technology and properties - art. no. 115011
[作者:Lohmuller, T; Muller, U; Breisch, S; Nisch, W; Rudorf, R; Schuhmann, W; Neugebauer, S; Kaczor, M; Linke, S; Lechner, S; Spatz, J; Stelzle, M,期刊:Journal of Micromechanics and Microengineering, 页码:15011-15011 , 文章类型: Article,,卷期:2008年18-11]
- A porous metal-insulator-metal sensor system was developed with the ultimate goal of enhancing the sensitivity of electrochemical sensors by taking advantage of redox cycling of electro active molecules between closely s...
- Self-sacrificial surface micromachining using poly(methyl methacrylate) - art. no. 115012
[作者:Johnstone, RW; Foulds, IG; Parameswaran, M,期刊:Journal of Micromechanics and Microengineering, 页码:15012-15012 , 文章类型: Article,,卷期:2008年18-11]
- This paper explains the idea of self-sacrificial surface micromachining. In a self-sacrificial process, there is no distinction between structural and sacrificial layers. Instead, during patterning, an in situ chemical c...
- The development of a tapered silicon micro-micromachining process for 3D microsystems packaging - art. no. 115028
[作者:Ranganathan, N; Lee, DY; Ebin, L; Balasubramanian, N; Prasad, K; Pey, KL,期刊:Journal of Micromechanics and Microengineering, 页码:15028-15028 , 文章类型: Article,,卷期:2008年18-11]
- It has been shown that as the aspect ratio of through-silicon vias (TSV) increases, tapering of TSV structure greatly helps in achieving good sidewall coverage for dielectric, barrier and copper seed metal layers to even...
- Deep-UV patterning of commercial grade PMMA for low-cost, large-scale microfluidics - art. no. 115029
[作者:Haiducu, M; Rahbar, M; Foulds, IG; Johnstone, RW; Sameoto, D; Parameswaran, M,期刊:Journal of Micromechanics and Microengineering, 页码:15029-15029 , 文章类型: Article,,卷期:2008年18-11]
- Although PMMA can be exposed using a variety of exposure sources, deep-UV at 254 nm is of interest because it is relatively inexpensive. Additionally, deep-UV sources can be readily scaled to large area exposures. Moreov...
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