- A highly integrated vertical SU8 valve for stepwise in-series reactions - art. no. 065037
[作者:Calvo, V; Ezkerra, A; Elizalde, J; Fernandez, LJ; Berganzo, J; Mayora, K; Ruano-Lopez, JM,期刊:Journal of Micromechanics and Microengineering, 页码:65037-65037 , 文章类型: Article,,卷期:2011年21-6]
- Stepwise performance of reactions demands highly integrated microfluidic control. The vertical valve presented in this work allows performing reactions in cascade with reduced control requirements, by controlling the rup...
- Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing - art. no. 065026
[作者:Lee, HS; Yang, HH; Ra, S; Yoon, JB,期刊:Journal of Micromechanics and Microengineering, 页码:65026-65026 , 文章类型: Article,,卷期:2011年21-6]
- Recently, as integration density of electrical devices has increased, multi-layered, fine-patterned printed circuit board (PCB) technology has been advancing. As a high-volume, low-cost manufacturing method, PCB fabricat...
- Bistable out-of-plane stress-mismatched thermally actuated bilayer devices with large deflection - art. no. 065030
[作者:Goessling, BA; Lucas, TM; Moiseeva, EV; Aebersold, JW; Harnett, CK,期刊:Journal of Micromechanics and Microengineering, 页码:65030-65030 , 文章类型: Article,,卷期:2011年21-6]
- In this paper, we explore microfabricated bistable actuators released as thin films from a silicon wafer. The actuators are based on a serpentine design where two cantilevers are coupled at the tips by a thin-film bar. T...
- Improving performance of the metal-to-metal contact RF MEMS switch with a Pt-Au microspring contact design - art. no. 065038
[作者:Liu, B; Lv, ZQ; He, XJ; Liu, M; Hao, YL; Li, ZH,期刊:Journal of Micromechanics and Microengineering, 页码:65038-65038 , 文章类型: Article,,卷期:2011年21-6]
- Performances of the metal-to-metal contact radio frequency (RF) MEMS switches largely rely on the contacts. A novel contact employing the microspring structure is demonstrated in this paper. The microspring contact can a...
- Parylene C-on-photoresist (POP): a low temperature spacer scheme for polymer/metal nanowire fabrication - art. no. 067001
[作者:Li, YH; Xie, Q; Wang, W; Zheng, MX; Zhang, H; Lei, YH; Zhang, HA; Wu, WG; Li, ZH,期刊:Journal of Micromechanics and Microengineering, 页码:67001-67001 , 文章类型: Article,,卷期:2011年21-6]
- This work introduced a novel spacer scheme for polymer/metal nanowire preparation by combining Parylene C and photoresist (Parylene C on photoresist, POP, process), both of which possess a low temperature fabrication ess...
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