- Torsion/cantilever-based MEMS bistable mechanisms with different support configurations: structure design and comparison - art. no. 045007
[作者:Wu, YB; Zhang, CC; Wang, H; Ding, GF,期刊:Journal of Micromechanics and Microengineering, 页码:45007-45007 , 文章类型: Article,,卷期:2011年21-4]
- Three types of torsion/cantilever-based MEMS bistable mechanisms (BMs) with different support configurations have been constructed, modeled and experimented. For the support configuration, there is a crisscross-shaped, a...
- Micro-structuring of thick NdFeB films using high-power plasma etching for magnetic MEMS application - art. no. 045011
[作者:Jiang, YG; Masaoka, S; Uehara, M; Fujita, T; Higuchi, K; Maenaka, K,期刊:Journal of Micromechanics and Microengineering, 页码:45011-45011 , 文章类型: Article,,卷期:2011年21-4]
- This paper describes the micro-patterning of thick NdFeB magnetic films using a high-power plasma etching method. The effects of RF bias power and gas composition on the selectivity and etching rate are experimentally st...
- Flexible and biocompatible microelectrode arrays fabricated by supersonic cluster beam deposition on SU-8 - art. no. 045013
[作者:Marelli, M; Divitini, G; Collini, C; Ravagnan, L; Corbelli, G; Ghisleri, C; Gianfelice, A; Lenardi, C; Milani, P; Lorenzelli, L,期刊:Journal of Micromechanics and Microengineering, 页码:45013-45013 , 文章类型: Article,,卷期:2011年21-4]
- We fabricated highly adherent and electrically conductive micropatterns on SU-8 by supersonic cluster beam deposition (SCBD). This technique is based on the aerodynamical acceleration of neutral metallic nanoparticles pr...
- Etch-stop technique for patterning of tunnel junctions for a magnetic field sensor - art. no. 045014
[作者:Persson, A; Ericson, F; Thornell, G; Nguyen, H,期刊:Journal of Micromechanics and Microengineering, 页码:45014-45014 , 文章类型: Article,,卷期:2011年21-4]
- Spin-dependent tunnelling devices, e. g. magnetic random access memories and highly sensitive tunnelling magnetoresistance (TMR) sensors, often consist of a large number of magnetic tunnel junctions (MTJs) of uniform qua...
- Vibration and shock reliability of MEMS: modeling and experimental validation - art. no. 045022
[作者:Sundaram, S; Tormen, M; Timotijevic, B; Lockhart, R; Overstolz, T; Stanley, RP; Shea, HR,期刊:Journal of Micromechanics and Microengineering, 页码:45022-45022 , 文章类型: Article,,卷期:2011年21-4]
- A methodology to predict shock and vibration levels that could lead to the failure of MEMS devices is reported as a function of vibration frequency and shock pulse duration. A combined experimental-analytical approach is...
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