- 3D micro-structures by piezoelectric inkjet printing of gold nanofluids
[作者:Kullmann, C; Schirmer, NC; Lee, MT; Ko, SH; Hotz, N; Grigoropoulos, CP; Poulikakos, D,期刊:Journal of Micromechanics and Microengineering, 页码:55022-55022 , 文章类型: Article,,卷期:2012年22-5]
- 3D solid and pocketed micro-wires and micro-walls are needed for emerging applications that require fine-scale functional structures in three dimensions, including micro-heaters, micro-reactors and solar cells. To fulfil...
- Optimization of NEMS pressure sensors with a multilayered diaphragm using silicon nanowires as piezoresistive sensing elements
[作者:Lou, L; Zhang, SS; Park, WT; Tsai, JM; Kwong, DL; Lee, C,期刊:Journal of Micromechanics and Microengineering, 页码:55012-55012 , 文章类型: Article,,卷期:2012年22-5]
- A pressure sensor with a 200 mu m diaphragm using silicon nanowires (SiNWs) as a piezoresistive sensing element is developed and optimized. The SiNWs are embedded in a multilayered diaphragm structure comprising silicon ...
- Study of design parameters affecting the motion of DNA for nanoinjection
[作者:David, RA; Jensen, BD; Black, JL; Burnett, SH; Howell, LL,期刊:Journal of Micromechanics and Microengineering, 页码:55006-55006 , 文章类型: Article,,卷期:2012年22-5]
- This paper reports the effects of various parameters on the attraction and repulsion of DNA to and from a silicon lance. An understanding of DNA motion is crucial for a new approach to insert DNA, or other foreign micros...
- Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias
[作者:Dixit, P; Vehmas, T; Vahanen, S; Monnoyer, P; Henttinen, K,期刊:Journal of Micromechanics and Microengineering, 页码:55021-55021 , 文章类型: Article,,卷期:2012年22-5]
- This paper presents the fabrication and the electrical characterization of poly-Si filled through-silicon vias, which were etched in a 180 mu m thin silicon device wafer, bonded to a handle wafer by plasma activated oxid...
- Ion multi-beam direct sputtering of Si imprint stamps and simulation of resulting structures
[作者:Eder-Kapl, S; Steiger-Thirsfeld, A; Wellenzohn, M; Koeck, A; Hainberger, R; Loeschner, H; Platzgummer, E,期刊:Journal of Micromechanics and Microengineering, 页码:55008-55008 , 文章类型: Article,,卷期:2012年22-5]
- The multibeam charged particle nanopatterning tool has been used to fabricate template structures with 10 keV Ar+ ion beam sputtering in Si. Trench array structures of 130 nm width, 280 nm depth and 80 degrees sidewall a...
- Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates
[作者:Fischer, AC; Gradin, H; Schroder, S; Braun, S; Stemme, G; van der Wijngaart, W; Niklaus, F,期刊:Journal of Micromechanics and Microengineering, 页码:55025-55025 , 文章类型: Article,,卷期:2012年22-5]
- This paper reports on a novel technique for the integration of NiTi shape memory alloy wires and other non-bondable wire materials into silicon-based microelectromechanical system structures using a standard wire-bonding...
|