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Electromigration in submicron interconnect features of integrated circuits
[
作者:Ceric, H; Selberherr, S,期刊:
MATERIALS SCIENCE & ENGINEERING R-REPORTS
, 页码:53-86 , 文章类型: Review,,卷期:
2011年71-5--6
]
Electromigration (EM) is a complex multiphysics problem including electrical thermal and mechanical aspects Since the first work on EM was published in 1907 extensive studies on EM have been conducted theoretically exper...